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| SK12 THRU SK110 SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER Reverse Voltage - 20 to 100 V Forward Current - 1 A Features * The plastic package carries Underwriters Laboratory Flammability Classification 94V-0 * For surface mounted applications * Metal silicon junction, majority carrier conduction * Low power loss, high efficiency * Built in strain relief, ideal for automated placement * High forward surge current capability Mechanical Data * Case: SMA (DO-214AC) molded plastic body * Terminals: leads solderable per MIL-STD-750, Method 2026 * Polarity: Color band denotes cathode end * Mounting Position: Any Maximum Ratings and Electrical Characteristics Ratings at 25 OC ambient temperature unless otherwise specified. Single phase, half-wave, 60 Hz, resistive or inductive load, for capacitive load current derate by 20%. Parameter Maximum Repetitive Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current Peak Forward Surge Current 8.3 ms Single Half Sine-Wave Superimposed on Rated Load (JEDEC Method) Maximum Instantaneous Forward Voltage at 1 A Maximum DC Reverse Current at Rated DC Blocking Voltage Typical Junction Capacitance 1) Typical Thermal Resistance 2) Symbols SK12 VRRM VRMS VDC IF(AV) IFSM VF IR CJ RJA TJ TSTG 20 14 20 SK13 30 21 30 SK14 40 28 40 SK15 50 35 50 1 40 SK16 60 42 60 SK18 SK110 Units 80 56 80 100 70 100 V V V A A 0.55 0.75 0.5 20 0.85 V mA TA = 25 OC TA = 100 OC 110 88 - 65 to + 125 90 O pF C/W O Operating Junction Temperature Range Storage Temperature Range 1) 2) - 65 to + 150 - 65 to + 150 C C O Measured at 1 MHz and applied reverse voltage of 4 V D.C. P.C.B. mounted with 0.2 X 0.2 (5 X 5 mm) copper pad areas. SEMTECH ELECTRONICS LTD. (Subsidiary of Sino-Tech International Holdings Limited, a company listed on the Hong Kong Stock Exchange, Stock Code: 724) (R) Dated : 14/04/2008 SK12 THRU SK110 SEMTECH ELECTRONICS LTD. (Subsidiary of Sino-Tech International Holdings Limited, a company listed on the Hong Kong Stock Exchange, Stock Code: 724) (R) Dated : 14/04/2008 |
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